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MindMap Gallery Detailed map of semiconductor equipment
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Detailed map of semiconductor equipment
When a forward voltage is applied to the diode (forward biased, the anode is connected to positive and the cathode is connected to negative), the diode is in a forward conducting state, the forward resistance of the diode is small, and the forward current is large.
Edited at 2022-08-10 14:05:32
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- One Hundred Years of Solitude Character Relationship Chart
One Hundred Years of Solitude is the masterpiece of Gabriel Garcia Marquez. Reading this book begins with making sense of the characters' relationships, which are centered on the Buendía family and tells the story of the family's prosperity and decline, internal relationships and political struggles, self-mixing and rebirth over the course of a hundred years.
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Project management is the process of applying specialized knowledge, skills, tools, and methods to project activities so that the project can achieve or exceed the set needs and expectations within the constraints of limited resources. This diagram provides a comprehensive overview of the 8 components of the project management process and can be used as a generic template for direct application.
Detailed map of semiconductor equipment
- One Hundred Years of Solitude Character Relationship Chart
One Hundred Years of Solitude is the masterpiece of Gabriel Garcia Marquez. Reading this book begins with making sense of the characters' relationships, which are centered on the Buendía family and tells the story of the family's prosperity and decline, internal relationships and political struggles, self-mixing and rebirth over the course of a hundred years.
- One Hundred Years of Solitude Character Relationship Chart
One Hundred Years of Solitude is the masterpiece of Gabriel Garcia Marquez. Reading this book begins with making sense of the characters' relationships, which are centered on the Buendía family and tells the story of the family's prosperity and decline, internal relationships and political struggles, self-mixing and rebirth over the course of a hundred years.
- Project Management Process Template
Project management is the process of applying specialized knowledge, skills, tools, and methods to project activities so that the project can achieve or exceed the set needs and expectations within the constraints of limited resources. This diagram provides a comprehensive overview of the 8 components of the project management process and can be used as a generic template for direct application.
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- Outline
Semiconductor equipment
Semiconductor Equipment Overview
Market size
Global $102.6 billion
Year-on-year ↑44%
Mainland China US$29.62 billion
Year-on-year ↑58%
Historical market share
Before 2013
Within 10%
2014-2017
10-20%
After 2018
More than 20%
Current market share
28.9%, first in the world
Top five global equipment
Front-end process (etching, deposition, coating, heat treatment, cleaning)
AMAT
LAM (Lam Research) Lam Semiconductor
TEL (Tokyo Electronics)
Lithography machine faucet
ASML market share is 80%
Process control faucet
KLA market share 50%
The top five manufacturers' semiconductor equipment revenue in 2019 totaled US$47.2 billion, accounting for approximately 78% of the global market.
Silicon wafer preparation
Silicon crystal preparation
Polycrystalline silicon classification
solar level
6N
electronic grade
9N-11N
The purity requirements are quite high, and the basic requirement is a thousand times the solar level.
Japan and the United States are leading in polysilicon technology, and their products are mainly electronic grade. China is mainly solar grade, and materials used in electronic grade and high-end solar fields mainly rely on imports.
Macroscopic data of polysilicon industry chain
Global polysilicon production: 642,000 tons
China's polysilicon production: 506,000 tons China's share: 78%
Global solar-grade polysilicon production: 584,000 tons of bulk silicon, 90.9%, 21,000 tons of granular silicon, 3.3%
Global electronic grade polysilicon production: 37,000 tons 5.8%
The increase in China's production capacity mainly comes from the commissioning of new production lines such as Tongwei and GCL-Poly, the resumption of production by China Silicon High-tech, Concentrator Silicon, etc., and the current enterprises are trying to improve their capacity utilization, and the output of some enterprises even exceeds the nominal production capacity.
Silicon equipment cost
The total investment of Daqo Energy’s 35,000-ton polysilicon project is approximately 1.003 billion yuan/10,000 tons; the total investment of Xint Inner Mongolia’s 100,000-ton polysilicon project (Phase I) is approximately 858 million yuan/10,000 tons.
According to the investment details of Daqo Energy’s 35,000-ton polysilicon project, of the project with a total investment of 3.5 billion yuan, the equipment purchase amount is approximately 1.73 billion yuan, accounting for 49.2%
Preparation
Modified Siemens method (mainstream)
The third-generation production process is the improved Siemens method. It adds a reduction exhaust gas dry recovery system and a SiCl4 recovery and hydrogenation process to the second-generation production process to achieve complete closed-loop production. It is the latest technology for the production of high-purity polysilicon by the Siemens method.
Currently, it is far safer than the silane fluidized bed method, and its production cost is also lower than the silane method in the short term. As long as there are no major breakthroughs in other technologies, the improved Siemens method is expected to maintain its competitive advantage for a long time.
In 2020, domestic polysilicon produced using the modified Siemens method accounted for approximately 97.2% of the country's total output.
Silane fluidized bed method
The main advantages are high conversion rate, low energy consumption, continuous production, and low by-product pollution. However, it has not been widely used due to problems such as poor safety, furnace wall deposition, fluidization control, and product purity control.
physical metallurgy
Simple equipment, low energy consumption, small investment, but low purity
It has basically been eliminated now.
Preparation process
Sand (quartz ore) main component SiO2
Carbon high temperature refining, oxidation reaction
=High purity silicon crystal
High Purity Silicon Crystal Pure Silicon Industrial Silicon (98% Silicon)
Pure silicon is crushed and reacted with anhydrous hydrogen chloride (HCI) in a fluidized bed reactor. Produces quasi-dissolved trichlorosilane (SiHCls).
Trichlorosilane (SiHCls)
The gaseous mixture produced in the second step needs to be further purified and needs to be decomposed: filtering the silicon powder, condensing SiHCls, SiC14, while the gaseous H2.HCl is returned to the reaction or discharged to the atmosphere. Then decompose the condensate SiHCls and SiC14 and purify trichlorosilane (multi-stage distillation).
Purified trichlorosilane
The purified trichlorosilane uses a high-temperature reduction process (performed in a reduction furnace) to reduce and deposit high-purity SiHCIs in an H2 atmosphere to generate polycrystalline silicon. The chemical reaction is:
use equipment
reduction furnace
listed company
Shuangliang Energy Saving
Polycrystalline silicon reduction furnace faucet
Main business:
Bromine cooler (heat pump) 31.19%
Polycrystalline silicon reduction furnace: 25.55%
Air cooler: 24.9%
Heat exchanger: 10.71
Monocrystalline silicon: 6.14%
Oriental electric heating
Main business:
Electric heaters for household appliances 49.94%
Optical communication steel aluminum-plastic composite material: 25.71%
New energy equipment: 14.58%
The company has disclosed its semi-annual performance forecast for 2022. The biggest impact on the company's performance in the first half of the year is the new energy equipment business, mainly polysilicon reduction furnaces and radiant electric heater products. This business has full orders on hand, and last year's orders were on hand. Most of the orders will be confirmed this year, and a small number of contracts signed at the beginning of the year are expected to be confirmed this year.
Lithium battery steel shell material: 4.11%
Electric heater for new energy vehicles: 3.69%
The company's current theoretical production capacity of PTC electric heaters for new energy vehicles is 250,000 sets/year. According to customer order needs, production shifts can be appropriately increased to increase actual output. Due to the current limited production capacity, the company's strategy is to protect key customers (such as BYD, Leapmotor, etc.). Theoretical production capacity is expected to reach 2 million units by the end of the year
Single crystal silicon preparation
Preparation
Czochralski method (CZ) [mainstream]
Preparation process
1. Heating: Use resistance or radio frequency heating coil to heat polysilicon until it melts
2. Access the seed crystal: Then use the seed crystal silicon contact Czochralski device to contact the liquid silicon surface
3. Solidification growth: Due to the temperature difference, liquid silicon solidifies on the surface of the seed crystal and grows to produce a single crystal with the same crystal structure.
4. Rotate and pull up to obtain a single crystal silicon rod: At the same time, the seed crystal is pulled up at a very slow speed and rotates at a certain speed to finally form a single crystal rod.
Fusion zone method (FZ)
The preparation process is shown in the figure.
characteristic
Due to technical limitations, the zone melting method can only produce silicon wafers of 8 inches (200mm) and below, and the cost, output, impurity control and other indicators are not as good as the Czochralski method. Therefore, the current mainstream process in the market adopts the Czochralski method. Monocrystalline silicon produced by the zone melting method is mostly used in power transistors, solar cells, etc.
use equipment
Single crystal furnace
Manufacturer
overseas
German PVA TePla AG, German Gero (Gero), American QuantumDesign (quantum design), American kayex, American GT Advanced Technologies, Japanese Ferrotec, etc.
domestic
Jingsheng Electromechanical, Nanjing Jingneng, Northern Huachuang, Jingyuntong, Huasheng Tianlong
listed company
Jingsheng Electromechanical
The absolute leader in domestic single crystal furnaces
The company is currently one of the only domestic manufacturers that masters 12-inch semiconductor single crystal furnaces and 8-inch area furnaces.
At present, the company has basically achieved full coverage from crystal growth to processing of 8-inch wafers, and has achieved mass production and batch shipment; the 12-inch single crystal silicon growth furnace, roller grinding equipment, cutting equipment, grinding equipment, and edge polishing equipment have been approved by customers. Verified and received good response, the 12-inch single crystal silicon growth furnace and some processing equipment have been sold in batches, and other processing equipment are also being verified by customers.
Liancheng CNC
Jingyuntong
Otway
String welding machine faucet
Northern Huachuang
Thermal field equipment (single crystal furnace subdivision)
The trend of carbon-based composites replacing graphite
The thermal field performance of carbon-based composite materials is better than that of graphite thermal fields. Under the trend of large size, the economics of carbon-based composite thermal fields is improved compared with isostatically pressed graphite. Carbon-based composite thermal fields are mainly domestically produced, eliminating the delay in the development of the industry caused by imported consumables.
Equipment value classification
crucible
57%
guide tube
twenty two
Thermos bucket
10
Special-shaped parts
10
listed company
Jinbo shares
Unresolved: Downstream situation
China’s monocrystalline silicon market share
Solar grade monocrystalline silicon
Market share 97.3%
Electronic grade monocrystalline silicon
Market share is less than 5%
Cutting Grinding Polishing
Cutting, grinding and polishing process
1. Section
Pinch off the head and tail, and the head and tail parts can be recycled
After detecting the impurity concentration by the four-probe method
Cut into several silicon segments of about 30cm
2. Rolling and grinding
The silicon segment is fixed to the machine and rolled with a side diamond grinding wheel.
If you get hot during the process, you need to continue to add water to cool down.
Purpose: Get silicon segments of fixed size (8 12)
3. Grinding the positioning edge (groove)
Grind another flat surface (positioning edge) on the side of the silicon segment
Positioning edge function 1: indicate crystal form and crystal orientation
Positioning edge function 2: Helping the photolithography machine to position and calibrate
4. Slicing [Slicer Diamond Wire]
To cut wafers from silicon segments, diamond multi-wire cutting machines are currently mainly used, and carbon steel wires are mainly used for busbars.
5. Grinding disc
The 12-inch silicon wafer is ground to a thickness of 775μm through grinding discs
Possible Process: Back Injury
Artificially rough backing (sandblasting, depositing a layer of polysilicon) traps unwanted impurities in the underlying layer to protect upper-layer devices
6.Chamfer
Grind the right angle of the edge of the silicon wafer into an arc shape
after
Laser marking code
fine grinding
Remove about 10μm thickness
chamfering effect
1. Due to the hard and brittle nature of high-purity silicon, the risk of cracking can be reduced after chamfering
2. In photolithography, photoresist is applied to the surface of the silicon wafer in a rotating manner. Chamfering can avoid the risk of photoresist depositing on the edge due to centrifugal force, causing uneven thickness and affecting photolithography.
3. Chamfering can avoid the risk of deposits preferentially accumulating on the right-angled edges during epitaxial growth, affecting the deposition effect.
7. Etching
Put into solvent for chemical etching
Hydrogen nitric acid and hydrofluoric acid are usually used to corrode the surface to a thickness of about 20-50μm.
Function: Remove mechanical damage during the previous polishing process and abrasives mixed into the surface of the silicon wafer
8. Chemical Mechanical Polishing (CMP)
Mount the silicon wafer on a rotating polishing instrument
The surface will be chemically oxidized by the abrasive liquid and then physically polished by the polishing pad.
The thickness of the silicon wafer will be thinned by about 5μm.
8-inch silicon wafers are usually polished on one side
12-inch silicon wafers are usually polished on both sides
9. Wet cleaning
Clean with deionized water and various chemical solvents
Purpose: Remove various dust and impurities from the adhering surface
Reason: Particulate matter can cause short circuit and open circuit of the device
Pollutant density and particle size are strictly regulated
10. Testing and packaging
Detect various core indicators
Flatness
cleanliness
Warpage
oxygen content
Metal residue
Electron microscopy
Optical detection
Put into a sealed box filled with nitrogen and sent to the wafer fab
cutting equipment
Slicer
The distance between the guide wheel shafts and the cutting line speed are two key indicators that reflect the diamond wire cutting equipment.
subtopic
company
Gaoche shares
The company is an industry leader in cutting equipment and diamond wire consumables
The company's current operating income from the photovoltaic industry accounts for more than 90% of its total operating income. In 2009, the company applied diamond wire cutting to the field of tire inspection. In 2011, it began to develop diamond wire technology for photovoltaic silicon material cutting and officially entered the market in 2015. In 2017, the company began to develop sapphire, magnetic materials, and semiconductor material cutting. In addition to equipment, the company's business has expanded to consumables and foundry services. In 2016, the company launched the photovoltaic cutting consumable diamond wire. In 2021, the company will begin to provide slicing and foundry services for photovoltaic silicon materials. The new business provides new growth points for performance.
On-machine CNC
The company is one of the top three photovoltaic diamond wire slicers in the field of special photovoltaic equipment, and the leader in 210 large-size silicon wafers in the field of monocrystalline silicon.
Liancheng CNC
In 2011, monocrystalline silicon and polycrystalline silicon slicing machines were developed, and in 2018, a 24-inch semiconductor-grade monocrystalline furnace was developed.
The company cooperates closely with Longi, the world's largest monocrystalline silicon manufacturer, and one of the actual controllers of the company is the chairman of Longi. LONGi is the company's largest customer, accounting for 93% of the company's sales revenue in 2020.
Important segmentation consumables: diamond wire
Material classification
busbar
Tungsten wire busbar
carbon steel wire
diamond particles
Material market characteristics
At present, diamond wire cutting has become the mainstream technology for silicon wafer cutting, completing a comprehensive domestic substitution.
Once a new technology breaks through in the cutting line, the original business will basically be scrapped.
Possible alternatives to tungsten wire
At present, what surpasses diamond wire cutting is tungsten wire, which has good performance, but the cost is too high and it does not have the ability to be a commercial substitute. If the cost comes down, it may completely replace diamond wire cutting.
Basically, other companies maintain an annual scale of 100 million to 300 million, and Meichang shares will be 1.85 billion in 2021. In terms of gross profit margin, Meichang Shares is 55%. Hengxing Technology has entered the market soon and ranks second with a gross profit margin of 42%. The third is Gaochai Shares, and the others are relatively low.
company
Meichang shares 54% market share in 2021
Diamond wire is the absolute leader, tungsten wire is in reserve
Has the lowest material and manufacturing costs in the industry
Attribution: The industry ceiling is small and the scale effect is strong
The production capacity in 2021 will be 70 million kilometers, and this year's production capacity will exceed 100 million kilometers. The entire market size will be more than 100 million kilometers. If Meichang Co., Ltd. releases all its production capacity, it can be covered. Meichang's current market share is 54%, and the plan for 2022 is to exceed 60%.
Gaoche shares
Tony Electronics
Tungsten
Stellar Technology
Sanchao new materials
Dailer new materials
Small batch trial production of tungsten wire cutting line
CMP (Chemical Mechanical Polishing) Equipment 3%
CMP equipment 32%
The number of polishing times has increased by multiples. The CMP steps of the mature process 90nm process are 12 steps, and the CMP steps of the advanced process 7nm process have been increased to 30 steps.
Market size
2020 USD 1.84 billion
The Chinese market is expected to be US$760 million in 2021
Global Market
U.S. Applied Materials 70%
Japan Ebara 25%
Domestic companies
Huahai Qingke (CMP equipment leader)
At present, the only domestic semiconductor equipment supplier that has achieved mass production and sales of 12-inch CMP equipment has been able to replace the products of industry leading companies in already mass-produced processes (14nm and above) and process applications.
Among the major domestic wafer fabs, Huahai Qingke’s share is rapidly increasing. In the Yangtze River Storage, Huahong Wuxi, Shanghai Huali Phase I and II projects, and Shanghai Jita CMP equipment procurement projects, the company won the bids for 8, 33, and 27 units respectively in the three years from 2019 to 2021, with the winning proportions being 21.05% and 27 respectively. 40.24%, 44.26%, the winning rate has increased year after year.
Beijing Shuoke
Device segmentation
polishing head
Usually there is a vacuum adsorption device to absorb the wafer to prevent the wafer from being displaced during the polishing process, and at the same time apply downward pressure.
grinding disc
It supports the wafer, carries the polishing pad and drives it to rotate, and controls the polishing head pressure, rotation speed, switching action, etc.
cleaning brush
It is used in the post-CMP cleaning process to remove particles and other chemical contaminants after CMP. It is divided into cleaning-rinsing-drying processes to ensure that the wafer is dry in and out.
Endpoint detection equipment
End point detection equipment is used to detect whether the CMP process has ground the material to the correct thickness to avoid the negative effects of being too thin (no polishing effect) and too thick (loss of underlying material). Electrical and optical measurements are usually used. Way
Consumables 68%
Global Market Size 2020
Polishing fluids $1.66 billion
Polishing pads $1.02 billion
China market size
3 billion yuan
CMP polishing fluid 49%
Market size 2020 USD 1.66 billion
company
Dinglong shares
Anji Technology
It is a mixture of abrasive materials and chemical additives that can produce an oxide film on the surface of the wafer, which is then removed by the abrasive particles in the polishing fluid to achieve the purpose of polishing.
global market share
Cabot 36%
80% in 2000 (decreasing year by year)
With the evolution of the process, the types of polishing fluids continue to expand in a diversified direction, from the original 4-5 types to more than 30 types. The technical difficulty has also become more complex, and customer needs have gradually diversified. Leading companies are very It is difficult to master core technologies in all subdivisions to form a monopoly. The localization self-sufficiency rate of regions has increased, creating opportunities and challenges for new entrants to enter the market.
Hitachi 15%
FUJIMI 11%
Versum 10%
Anji Technology 2%
Domestic market share
Cabot 36%
Anji Technology 13%
The company's current chemical mechanical polishing fluid has achieved large-scale sales at the 130-28nm technology node, the 14nm technology node products have entered the customer certification stage, and the 10-7nm technology node products are under development.
Hitachi 12%
FUJIMI 5%
Huizhan Materials 4%
Fujifilm 3%
Dow 2%
CMP polishing pad 33%
Market size 2020 USD 1.02 billion
Global market share
Dow 79%
Cabot 5%
Thomas West 4%
FOJIBO 2%
JetSea 1%
Domestic manufacturers
Dinglong shares
Dinglong Co., Ltd. took the lead to break through and became the only local supplier of CMP polishing pads, breaking the foreign monopoly.
In 2020, CMP polishing pad products have been introduced to important domestic wafer manufacturers such as leading downstream memory chips, power chips, and logic chips. Among them, the company's 28nm and above polishing pads have received mass production orders from major domestic storage manufacturers. In March 2022, the company's alumina polishing slurry products also passed customer certification and entered the ton-level procurement stage, achieving independent preparation of key materials.
The domestic market share will increase from less than 10% in 2020 to 15% in 2021. The company's polishing pad products have achieved 100% full coverage of mature processes and advanced processes.
The main function is to store and transport polishing fluid, remove abrasive debris and maintain a stable polishing environment. The polishing pad is composed of porous and elastic polymer materials. It has sponge-like mechanical properties and porous properties, and has special grooves on the surface. Improves polishing uniformity. Its main function is to store and transport polishing fluid, remove abrasive debris and maintain a stable polishing environment to ensure uniform polishing.
CMP Diamond Disc
It is an essential consumable in the CMP process. It is used to maintain a certain roughness on the surface of the polishing pad. It is usually used in conjunction with the CMP polishing pad.
CMP cleaning solution 5%
It is mainly used to remove dust particles, organic matter, inorganic matter, metal ions, oxides and other impurities remaining on the surface of the wafer to meet the extremely high cleanliness requirements of integrated circuit manufacturing and plays an important role in the yield of wafer production. effect.
Jingsheng Electromechanical
The absolute leader in domestic single crystal furnaces
The company is currently one of the only domestic manufacturers that masters 12-inch semiconductor single crystal furnaces and 8-inch area furnaces.
At present, the company has basically achieved full coverage from crystal growth to processing of 8-inch wafers, and has achieved mass production and batch shipment; the 12-inch single crystal silicon growth furnace, roller grinding equipment, cutting equipment, grinding equipment, and edge polishing equipment have been approved by customers. Verified and received good response, the 12-inch single crystal silicon growth furnace and some processing equipment have been sold in batches, and other processing equipment are also being verified by customers.
Pre-process
Cleaning equipment 4%
With the continuous advancement of semiconductor technology, the integration level of semiconductor devices continues to increase, and the cleaning steps have increased significantly. The 90nm chip cleaning process has about 90 steps, and the 20nm cleaning process reaches 215 steps. As chips enter 16nm and below, the number of cleaning processes will accelerate.
The cleaning step accounts for 30% of the entire wafer manufacturing process, so the number of cleaning processes increases with the advancement of technology nodes.
Market size
2018 USD 3.4 billion
The prosperity of the industry has declined, and the market size has declined year by year.
2020 USD 2.5 billion 4%
Localization process: 20% (mainly Shengmei Shanghai)
Equipment process classification
Wet cleaning accounts for the majority share
Single chip cleaning equipment 74.5%
Tank cleaning equipment 18.%
Single piece trough combination
Batch rotating spray
Dry cleaning (used in advanced processes)
plasma cleaning
Vapor phase cleaning
Beam cleaning
Scrubber 6.8%
foreign companies
Japanese Deans 45%
Tokyo Electronics 20%
Fine things 14.6%
Ram Research Lam Semiconductor 13.4%
Domestic companies
Shengmei Shanghai [Cleaning Machine Faucet] 4%
Possess equipment technology of 14nm and above, and reserve 5-7nm technology
Pure Technology
Trough type equipment
Xinyuan Micro
Possess cleaning equipment technology of 28nm and above, and reserve 14nm technology
Northern Huachuang
From the perspective of cleaning efficiency, taking the single-wafer type as an example, the 8-cavity Ultra C single-wafer cleaning series of Shengmei Technology Co., Ltd. has a production capacity of 225 wafers/hour, and the 12-cavity production capacity can reach 375 wafers/hour; Zhichun Technology single-wafer cleaning series The maximum production capacity of the 8-cavity ULTRON series cleaning machine can reach 295 pieces/hour, and the maximum production capacity of the 12-cavity machine can reach 590 pieces/hour.
Heat treatment 2.5-3%
Process classification
Oxidation
A process in which a silicon wafer is placed in an atmosphere of an oxidizing agent such as oxygen or water vapor for high-temperature heat treatment, and a chemical reaction occurs on the surface of the silicon wafer to form an oxide film.
Diffusion (thermal diffusion in doping)
Diffusion refers to using the principle of thermal diffusion under high temperature conditions to incorporate impurity elements into the silicon substrate according to process requirements, so that it has a specific concentration distribution, thereby changing the electrical properties of the silicon material.
annealing
Annealing refers to the process of heating the silicon wafer after ion implantation to repair the lattice defects caused by the ion implantation.
Equipment classification
Rapid temperature rise furnace (RTP) 46%
It was first used for annealing after ion implantation, and later expanded to wider fields such as the formation of oxidized metal silicide and rapid thermal chemical vapor deposition and epitaxial growth.
Horizontal furnace
vertical furnace
Market size
2020 USD 1.54 billion
Rapid heat treatment equipment market size is US$720 million
The market size of oxidation/diffusion equipment is approximately US$550 million
The market size of GateStack equipment is US$270 million.
FinFET devices
competitive landscape
Oxidation diffusion furnace
AMAT 40%
TEL 20%
Hitachi International 19%
ASML 5%
Yitang shares 5%
Deans 4%
Rapid Temperature Furnace (RTP)
AMAT 70%
Yitang shares 11%
International Electrical 9%
Vico 6%
Scullin 4%
Domestic manufacturers
Northern Huachuang
Northern Huachuang's THEORIS 302/FLOURIS 201 vertical oxidation furnace can cover 8-inch, 12-inch 28nm and above integrated circuits, advanced packaging, and power devices.
Yitang shares
The main heat treatment products of Yitang Co., Ltd. are rapid heat treatment (RTP) and millisecond rapid heat treatment (MSA). The products have covered well-known domestic and foreign manufacturers such as TSMC, Samsung Electronics, SMIC, Huahong Group, and Yangtze Memory.
Thin film deposition 27%
Market size
2020 USD 17.2 billion
Thin film types in IC
Dielectric film (SiO2, SiN)
It is used to isolate the conductive layer, as a masking film for diffusion and ion implantation, or to prevent the loss of dopants, or to cover the device from impurities, water vapor or scratches.
polysilicon
Gate deposition materials for MOS devices, multi-layer metal conduction materials or contact materials
Metal film (aluminum, copper or metal silicide)
Form a low-resistance metal connection.
【Interconnect Technology】
Integrated circuit interconnection technology is a technology that connects independent components in the same chip into circuit modules with certain functions in a certain way. The requirements for interconnection metal materials of integrated circuits are: 1. Have small resistivity, 2. Be easy to deposit and etch, 3. Have good anti-electron migration properties;
local interconnection
Local interconnects are often thin and short in length,
contact hole
In logic devices, transistor contacts and local interconnects form the critical electrical path between the transistor and the rest of the circuit. Therefore, low resistivity is critical for robust and reliable device performance. For 25 years, the low-resistivity conductive material tungsten (W) has been used for logic contacts and local interconnect filling.
Advances in Moore's Law have led to a shift in local interconnect fill and contact hole materials from tungsten to cobalt
global interconnection
Global interconnects carry current between different blocks of a circuit, so global interconnect lines are often thick, long, and widely separated. The connections between interconnect levels, called vias, allow signals and power to pass from one layer to the next.
Three coating processes
PVD physical vapor deposition 20%
The growth mechanism is simple and the deposition efficiency is high. It is not suitable for surface deposition on three-dimensional complex substrates.
Sputtering PVD 21% accounted for US$3 billion
Applied Materials has an exclusive market share of 87% in sputtering PVD equipment and has absolute dominance.
Consumables: sputtering target
Market size
Classification
Semiconductor target
The global market space in 2019 is US$2.87 billion
China market size in 2019: 4.77 billion yuan
The sputtering targets used mainly include aluminum targets, titanium targets, copper targets, tantalum targets, tungsten-titanium targets, etc.
flat panel display target
In the most widely used TFT-LCD production process, sputtering targets are mainly used for the preparation of thin film transistors (TFT) and color filters (CF).
The main varieties include: molybdenum target, aluminum target, aluminum alloy target, chromium target, copper target, copper alloy target, silicon target, titanium target, niobium target and indium tin oxide (ITO) target, etc.
Photovoltaic target
The more commonly used sputtering targets include aluminum targets, copper targets, molybdenum targets, chromium targets, ITO targets, AZO targets (Aluminum Zinc Oxide, aluminum zinc oxide), etc. The purity requirements are generally above 99.99%. Among them, aluminum targets, copper Targets are used for conductive layer films, molybdenum targets and chromium targets are used for barrier films, and ITO and AZO targets are used for transparent conductive layer films.
competitive landscape
Japan Mining Metal 30%
Honeywell 20%
Tosoh 20%
Praxair 10%
Domestic companies
Jiangfeng Electronics
CVD chemical vapor deposition 64%
Uniformity, repeatability and step coverage are good, but it is difficult to achieve precise control of film uniformity and thickness.
Segmentation
PECVD 33% accounted for US$4.7 billion
Structural classification
Plasma enhanced CVD
High Density Plasma CVD (HDPCVD)
The working principle is to apply radio frequency power in a vacuum chamber to decompose gas molecules into plasma. The role of the plasma is to trigger chemical reactions and provide the energy and heat needed to sustain CVD deposition. Less deposition occurs outside the silicon wafer, resulting in shorter cleaning downtime.
The introduction of plasma effectively reduces the thermal budget of the deposition process, while improving the deposition rate and filling capacity of high aspect ratio pores.
Tubular CVD (tube furnace) 10% accounted for US$1.4 billion
APCVD
Normal pressure CVD
Continuous APCVD systems have high equipment throughput, excellent continuity, and the ability to manufacture large-diameter silicon wafers. The problem is the higher gas consumption and the need for frequent cleaning of the reaction chamber and conveyor.
It is mainly used to deposit SiO2 and doped silicon oxide (such as PSG, BPSG, FSG) films as interlayer dielectric (ILD), which plays the role of protective covering or surface planarization.
LPCVD
Low pressure CVD
It has gradually been surpassed by the more widely used plasma and atomic layer deposition technologies.
Non-tube LPCVD 11%
MOCVD 4%
Metal-organic CVD
Subatmospheric pressure chemical vapor deposition (SACVD)
ALD atomic layer deposition 13%
Excellent performance, can accurately control film thickness, but low efficiency. Advantages in step coverage
NAND flash memory changes from 2D to 3D to drive increased demand for ALD equipment
ALD is based on the self-limiting properties of chemical adsorption and sequential reactions, and can achieve thin film deposition with a single layer of atoms as the thickness unit. According to Gartner, plasma CVD and ALD will account for 51% and 19% of the CVD equipment market respectively by 2024.
Classification
PEALD (mainly deposits dielectric films, used in SADP, STI processes art)
High-end storage applications
Thermal ALD (mainly deposits metal compound films, used in HKMG process)
Both PVD and CVD have high film forming efficiency, several microns per minute, and ALD efficiency is only a few nanometers per minute.
equipment company
Three giants in the thin film deposition market
Applied Materials 30%
Applied Materials has an exclusive market share of 87% in sputtering PVD equipment and has absolute dominance.
PECVD also has a share of nearly 49%
Lam Research (Lam Semiconductor Lam Research) 21%
Fanlin occupies a higher share in the LPCVD and electroplating equipment market
PECVD also has a share of nearly 34%
Tokyo Electron (TEL Tokyo Electronics) 19%
Tokyo Electronics has a market share of 46% in tubular CVD equipment
ALD 31%
ASM International
Conductor equipment giant ASMI has strong technical reserves in atomic layer deposition (ALD) suitable for advanced processes, with a market share of 29% in the corresponding market segments.
Tubular CVD equipment market share reaches 3%
Kokusai Electric
Tubular CVD equipment market share reaches 51%
Other foreign manufacturers
Wonik IPS
Eugene Technology
Jusung Engineering
TES
SPTS Technologies (KLA)
Veeco
CVD Equipment
Tuojing Technology
Northern Huachuang
Domestic companies
Tuojing Technology [All equipment is thin film deposition equipment]
From January to May 2022, Tuojing Technology’s share of winning bids for domestic thin film deposition equipment rose rapidly to 14%, ahead of other domestic manufacturers.
Currently, the company is implementing major national science and technology projects related to ALD (in cooperation with Changjiang Memory) and advanced process PECVD (in cooperation with Changxin Memory), which are expected to help the company further break through the high-end thin film deposition equipment market
Mainly based on CVD technology, among which PECVD was developed earlier and is relatively mature, which can partially replace foreign manufacturers, and its products have entered first-tier manufacturers such as SMIC, Huahong, and Yangtze Memory. SACVD and ALD machines have been developed and are available in small quantities
product matrix
PECVD
Main products account for 90%
Used in semiconductor front-end manufacturing
SACVD
Accounting for 5% Newly developed products in recent years
Industrial application; used for STI trench filling, etc.
ALD
Accounting for 3.78%
PEALD (mainly deposits dielectric films, used in SADP and STI processes)
Northern Huachuang
PVD technology is the strongest in the field of deposition, and can partially replace applied materials equipment, and its products are supplied to first-tier manufacturers in batches. The CVD field has technologies such as LPCVD and APCVD, mainly equipment below 8 inches. ALD equipment has also been developed and supplied in small quantities.
PECVD
Bulk sales; mainly used in LED, MEMS, power fields
APCVD
Volume sales; for 6- and 8-inch wafer epitaxy
LPCVD
Volume sales; used for gate oxide film deposition
ALD
Thermal ALD industrial application (mainly depositing metal compound films for HKMG process)
PVD
Sold in bulk; used to deposit metal thin films
furnace tube
Bulk sales
Shengmei Shanghai
LPCVD
SiN LPCVD delivered to customers
ALD
Furnace tube ALD is under development and expected to be launched in 2022
furnace tube
Demo is under verification, revenue will be recognized in 2022
AMEC
LPCVD
Under development
MOCVD
Bulk sales; for LED epitaxial wafers
Bitong Semiconductor (unlisted)
PECVD
Deliver the first 12-inch PECVD to Qingdao Xinen in 2021
PVD
Launch of 8-inch product
Jiaxing Kemin (unlisted)
ALD
Both ALD equipment are available
PVD
Optical exposure (photolithography)
Process flow
1. Wafer cleaning and priming (deposition)
2. Spin coating photoresist
Glue coating and developing equipment
3. Pre-baking (soft baking)
4. Alignment and exposure
5. Post-baking (PEB)
6.Develop and rinse
Glue coating and developing equipment
7. Hard film (hard baking)
equipment
Lithography machine 20%
Lithography machine classification
EUV
Currently the most high-end
22-7nm
DUV
ArFi
45-22nm
AHr
135-65nm
htK
180-135nm
i line
800-250 nm
The three major international lithography machine giants
ASML
The most high-end model EUV can only be done by ASML
In 2020, the three high-end models of EUV, ArFi and ArF shipped 145 units, accounting for 95.4%.
EUV 42 units
100%
ArFi 81 units
96%
ArF 22 units
88%
Nikon
In 2020, the three high-end models of EUV, ArFi and ArF shipped 7 units, accounting for 4.6%
ArFi 4 units
ArF 3 units
Canon
Glue coating and developing equipment 3%
Market share 20 years USD 1.9 billion
Features
The accuracy of development is the accuracy of photolithography, so glue coating and development equipment is also very important for the formation of key processes.
In addition to the high-end increment brought by front-end EUV lithography, there is also market growth in relatively low-end coating and development equipment used in back-end packaging and testing, LED manufacturing, etc.
international market share
Tokyo Electronics and TEL dominate the market 87%
China market share
Tokyo Electronics Market accounts for over 90%
Xinyuan Micro accounts for 4% of the domestic market
Domestic companies
Xinyuan Micro
Glue coating and development equipment used for front-end wafer manufacturing is still in the new stage. The products have been sent to many customers such as Shanghai Huali, Yangtze Memory, Center Shaoxing, and Shanghai Jita for verification. Some products have passed verification and received orders. Xinyuan Micro's current main products are glue coating and development equipment used in back-end advanced packaging and LED manufacturing, and its products have entered mainstream major customers.
Consumables
Photoresist
Classification
Positive photoresist (positive photoresist)
After light irradiation, the photosensitive part decomposes and becomes soluble in the developer, leaving the non-photosensitive part.
Negative photoresist (negative photoresist)
After exposure, a cross-linked lattice structure is formed. It is insoluble in the developer and the unsensitized part is dissolved.
company
Tongcheng New Materials
NTU Optoelectronics
Shanghai Xinyang
Feikai Materials
Panel photoresist has been verified by downstream manufacturers in the field of high-end wet film photoresist
Large photosensitivity
PCB photosensitive ink photoresist supporting chemicals
Yongtai Technology
Strong new materials
Measurement inspection (front inspection) 11-13%
Process flow
8. Measurement and inspection
Unqualified
After the glue is removed, the wafer is cleaned again for the exposure process.
qualified
Enter the graphics transfer process
Detect chip line width, film thickness, distance difference, impurities, and defects (optical inspection)
Classification
Defect detection category 55%
Used to detect defects on wafer surface
Technical path
Optical technology
Traditional inspection technology is mainly based on optical inspection. It compares adjacent wafers through the principle of optical imaging, and can conduct large-scale inspection in a short time.
electron beam technology
However, as the semiconductor manufacturing process continues to shrink, the sensitivity of optical detection in image recognition in advanced process technology has gradually weakened. Therefore, electron beam detection technology is used more in advanced processes.
Electron beam technology is not affected by certain surface physical properties and can detect small surface defects, such as gate etching residues. Compared with optical detection technology, electron beam detection technology has higher sensitivity, but the detection speed is slower. Therefore, in the production process of advanced process chips, optical inspection and electron beam inspection technologies will be used to assist each other to quickly find defects in wafer production and control and improve them.
Clear/dark field optical pattern picture defect detection equipment, non-graphic surface detection equipment, macro defect detection equipment
Pattern wafer inspection 32%
Unpatterned wafer inspection 5%
Electron beam inspection 11%
Macroscopic defect detection 6%
Measurement category 34%
Mainly used to measure transparent film thickness, opaque film thickness, film stress, doping concentration, critical dimensions, registration accuracy and other indicators
Corresponding equipment: ellipsometer, four-probe, atomic force microscope, CD-SEM, OCD equipment, thin film measurement, etc.
Film thickness measurement 12%
OCD measurement 10%
Topography measurement 6%
Overlay error measurement 9%
CD-SEM measurement 12%
Process control software 11%
Process classification
Front-end measurement equipment accounts for 60% of the market share of measurement equipment
Process control equipment
Market size
Global USD 7.65 billion in 2020
China US$2.1 billion in 2020
competitive landscape
Kelei Semiconductor KLA 52%
Applied Materials AMAT 12%
Hitachi subsidiary Hitachi High-tech 11%
Others 25%
Domestic companies
Jingce Electronics (subsidiary Shanghai Jingce)
The company has now formed three major product series: film thickness/OCD measurement equipment, electron beam measurement equipment, and pan-semiconductor equipment. Shanghai's precision film thickness measurement products (including independent film thickness equipment) have received batch repeat orders from domestic first-line customers. In the first half of the year, the company achieved delivery of the first 12-inch wafer appearance defect inspection equipment, and the first independent OCD equipment and Review SEM were shipped. .
Shanghai Ruili (Ruili Scientific Instruments)
The company's products are deeply involved in the field of measurement. Its main products include TFX3000 series film thickness measurement equipment, TFX3000 OCD optical critical dimension (OCD) and topography measurement system, FSD300 automatic macro defect detection system and WSD200 optical defect detection equipment. The company's shareholders include China Microelectronics The company (20.45%), Pudong Science and Technology Innovation (15.04%), Zhangjiang Science and Technology Investment (11.13%), National Fund (8.78%), Shanghai Venture Capital (4.95%), Shanghai Guosheng (3.35%) and other well-known industrial investments mechanism.
Zhongke flying test
The company's wafer surface particle inspection machine has successfully entered the SMIC production line, the intelligent visual inspection system has successfully entered the Yangtze River Storage production line, and the elliptical film thickness measuring instrument has entered the Silan Micro production line.
Dongfang Jingyuan
The company's products mainly cover three major areas, namely OPC (computational lithography products), EBI (electron beam defect inspection) and CD-SEM (critical dimension measurement). At present, the company has achieved the verification of the first domestic set of EBI equipment in the customer's mainstream process. , completed the research and development of the first CD-SEM in China and delivered it to SMIC this year, filling key gaps in the current EBI and CD-SEM fields.
In 2020, the domestic production rate of front-end inspection equipment was only 2%.
Back-end mid-test and back-end final testing account for 40% of the market share of measurement equipment.
2020 USD 6.01 billion
Automatic testing equipment (ATE)
Test machine 63.1%
Currently, Teradyne and Advantest occupy monopoly positions in the global and domestic semiconductor testing equipment markets, and their main products are SoC and memory testers.
The core instrument in the post-test session. In the testing process, the testing machine occupies the most important position. It mainly uses computer automatic control to detect the circuit functions and electrical performance parameters of semiconductor devices.
Memory testers and SoC testers accounted for 43.8% and 23.5% respectively, being the main tester categories.
Classification
Memory test machine 43.8%
SOC testing machine 23.5%
Digital testing machine 12.7%
Simulation test machine 12%
Simulation/hybrid testing machines have been replaced by domestic ones. According to 2020 sales estimates, the combined market share of Huafon Measurement and Control and Changchuan Technology has exceeded 80%;
Sorting machine 17.4%
Equipment for chip screening and classification. In the FT test link, the sorter is responsible for transporting the input chips to the test machine according to the pick-and-place method designed by the system to complete the circuit stress test, and select and classify the chips based on the test results.
The global market size of sorting machines in 2020 is approximately US$930 million. Compared with testing machines and probe stations, the competitive landscape is more fragmented
The top five companies are Kexiu, Xcerra (acquired by Kexiu), Advant, Hongjin Precision and Changchuan Technology. The CR5 in 2018 was 59%. The market share of Kexiu, the largest company, was 21%. The domestic company Changchuan Technology accounts for 2%.
Classification
Gravity sorting machine
Turret sorting machine
Translational pick and place sorting machine
Probe station 15.2%
The person responsible for wafer transportation and positioning tasks, and the key equipment for detecting the electrical and optical parameters of semiconductor chips.
International competitive landscape
Currently, Teradyne and Advantest occupy monopoly positions in the global and domestic semiconductor testing equipment markets, and their main products are SoC and memory testers. Due to the rich product lines and significant technological leadership of the duopoly, in 2018 they accounted for 90% and 82.0% of the global and Chinese market shares respectively.
advan
Teradyne
coliden
Ke Xiu
Domestic companies
Huafeng Measurement and Control 6.1%
Changchuan Technology 2.4%
Jinhaitong
China's Huafeng Measurement and Control and Changchuan Technology are the two largest companies in China. Their products are mainly analog/hybrid test systems, accounting for 6.1% and 2.4% of China's integrated circuit testing machine market share respectively.
graphics transfer
Etch 20%
competitive landscape
The global etching equipment market size in 2020 is US$12.33 billion
In 2019, the top three companies in the global etching equipment industry are Lam Semiconductor (RAM Research), Tokyo Electronics, and Applied Materials, with CR3 exceeding 90%. Among domestic companies, AMEC's dielectric etching machines are the world's leading and have entered TSMC's latest process production line. In 2019, the global market share was approximately 1.1%. Northern Huachuang's silicon etching machines and metal etching machines lead the country, with a global market share of approximately 0.8% in 2019.
Lam Semiconductor (Ram Research) 44.7%
Tokyo Electronics 28%
Applied Materials 18.1%
Hitachi 5.2%
SEMES 2.5%
Kelei Semiconductor 1.4%
AMEC 1.4%
Northern Huachuang 0.9%
effect
Etching refers to the process of selectively removing unnecessary materials from the surface of a wafer using chemical or physical methods. The removed part can be the material deposited on the wafer, or it can be the substrate material itself. The purpose of etching is to accurately copy the photoresist pattern onto the wafer. During the etching process, the wafer surface protected by the photoresist is not corroded by etching liquid or other etching sources, while the unprotected parts are corroded away.
characteristic
Important features of etching machines: The number of etchings increases significantly under different processes
Reason: Since the photolithography step of the photolithography machine is limited by the length of the light wavelength below 20nm, it cannot directly perform the photolithography and etching steps. Instead, it uses multiple photolithography and etching to produce smaller structures that meet people's requirements. At present, the principle of multiple template processes is commonly used, that is, through multiple deposition, etching and other processes, a 10nm line width process is achieved. (Even for EUV, the wavelength is 13.5nm. To achieve 7nm accuracy, you still need to rely on multiple patterning technology, that is, multiple etchings. Therefore, as the process upgrades, the higher the accuracy, the required etching complexity and number of steps are also increasing. )
Classification
Classification according to etching principle
dry etching
Ion beam sputter etching IBE
Plasma etchingPlasma
Reactive Ion Etching (RIE)
Capacitively coupled plasma etching CCP
High energy, low precision, used for dielectric material etching (forming upper layer circuits) [oxide, nitride, organic mask]
Inductively coupled plasma etching ICP
Low energy, high precision, mainly used for silicon etching and metal etching (forming underlying devices) [monocrystalline silicon polycrystalline silicon]
Atomic Layer Etching ALE
Future technology development direction, can accurately etch to the atomic layer (about 0.4nm), with ultra-high etching selectivity
The most widely used etching equipment is ICP and CCP, and the technology development direction is atomic layer etching (ALE).
Wet etching
Classification by etching materials
Dielectric etching 39%
Conductor etching 61%
Silicon etching
Single crystal silicon etching
Polysilicon etching
Metal etching (less)
Doping
Why doping:
Since intrinsic silicon (i.e. silicon single crystal without impurities) has very poor electrical conductivity, it can only function as a semiconductor when an appropriate amount of impurities are added to the silicon to change its structure and electrical properties. This process is called doping .
Doping changes wafer’s electrical properties
The ion implantation effect determines the most basic and core performance of the device in the internal structure of the chip.
Ion implantation (the most important doping method)
Market size
2020 3% US$1.8 billion
Theory and properties
High-pressure ion bombardment is used to introduce impurities into the silicon wafer, and the impurities can only be implanted after high-energy collisions at the atomic level with the silicon wafer.
Low-energy ion implanters are widely used in the underlying processes of advanced process chips
Precise controllability makes ion implantation technology the most important doping method.
The integrated circuit (IC) ion implanter market is highly concentrated due to the high technical barriers to IC ion implantation.
All injection processes are performed under high vacuum. This process has extremely high requirements for equipment stability and precision. Therefore, ion implanters, thin film deposition equipment, photolithography equipment, and etching equipment are listed as the four key process equipment for integrated circuit manufacturing.
An 8-inch mature process logic production line with a production capacity of 10,000 pieces per month requires an average of 3.4 ion implantation equipment, a 12-inch mature process logic production line requires an average of 13 ion implantation equipment, and a 12-inch advanced process logic production line requires an average of ion implantation equipment. 9 units.
Influencing factors
Dose: the number of ions injected per unit area of the silicon wafer surface. The number of unit ions increases when the current increases.
Range: the total distance that ions penetrate into the silicon wafer, related to the energy and quality of the injected ions
Implantation angle: Angle control also affects the range of ion implantation.
Equipment classification
Low energy large beam ion implanter 60%
High energy ion implanter 18%
Medium and low beam ion implanter 20%
Oxygen injection machine
Hydrogen ion implanter
global competitive landscape
AMAT (Applied Materials) 70% market share, absolute leader
The main products include large-beam ion implanters, medium-beam ion implanters, and ultra-high-dose ion implanters.
United States Axcelis (Asheli Technology Design Company) 19%
The main product, high-energy ion implanter, has a market share of 55%. Axcelis' sales in 2020 were US$475 million and net profit was US$50 million.
Japanese Nissin
It mainly produces medium-beam ion implanters, with a market share of about 10% in medium-beam ion implanters. It has won the bid for ion implanters in my country's Gu'an OLED project and Hefei Jinghe 12-inch project.
Japan SEN
Products include high-beam ion implanters, medium-beam ion implanters, and high-energy ion implanters. Among them, the revenue share of medium-beam ion implanters and high-energy ion implanters is slightly higher, but their market share in mainland China relatively low.
Domestic competition landscape
AMAT (Applied Materials) accounts for about 70% of the market and is the absolute leader
American Axcelis (Asheli Technology Design Company)
Sumitomo Electric Co., Ltd.
AIBT
Domestic ion implanters are basically monopolized by Applied Materials, Axcelis and Sumitomo of Japan. Only Keshitong and Zhongkexin under Wanye Enterprise have obtained process verification and acceptance on some 12-inch wafer production lines.
Domestic enterprises
Wanye Enterprise (Kaishitong)
In 2018, Wanye Enterprise acquired Keshitong
In December 2020, we received orders for 3 ion implanters, namely a low-energy large-beam heavy metal ion implanter (Sb implanter), a low-energy large-beam ultra-low-temperature ion implanter (Cold implanter), and a high-energy ion implanter (HE implanter). The order amount is 1 billion (including tax).
FinFET, the full name of Fin Field Effect Transistor, is a more effective transistor structure that can solve the problem of leakage current, so it has obvious advantages in the selection of advanced process solutions. The all-around gate transistor (GAA) is a transistor structure that has more advantages in leakage issues. It is considered the next successor to the fin structure and will definitely replace FinFET at the 3-5nm process node.
China Electronics Technology Group (China Science and Technology Corporation)
It has formed a full range of ion implanter product systems including medium beam current, large beam current, high energy, special applications and third-generation semiconductors. It has a postdoctoral research station and established an ion implanter industrialization platform that meets SEMI standard requirements. The annual production capacity reaches 30 Taiwan, its products are widely used in well-known chip manufacturing companies around the world and are highly recognized by customers.
Thermal diffusion
High temperature is used to drive impurities through the lattice structure of silicon. The doping effect is affected by time and temperature.
Diffusion with heat treatment
Remove glue
Stripping is the process of removing residual photoresist after etching or ion implantation. The stripping process is similar to etching, except that the stripping operation object is photoresist, while the etching operation object is the wafer dielectric material.
Classification
Wet glue removal
Wet stripping is to soak the wafer with photoresist in an appropriate organic solvent to dissolve or decompose the photoresist, and remove the photoresist from the wafer surface.
Dry glue removal [mainstream technology]
The photoresist is removed by the reaction between oxygen atoms and photoresist in a plasma environment.
At present, semiconductor manufacturers usually use two degumming methods, wet degumming and dry degumming, with wet degumming being a useful supplement to dry degumming.
Market size
Market size in 2020: US$538 million
Market structure
Yitang Semiconductor 31.3%
90% share of domestic market
The company's RTP rapid annealing and dry etching equipment also has considerable technical strength, especially RTP equipment
The technical main body of Yitang Semiconductor is the US company Mattson Technology (MTSN.O) acquired in 2016. This acquisition is also the first successful cross-border acquisition of a semiconductor equipment company by Chinese capital.
25.9% better than Cisco
Hitachi High-tech 19.2%
Lam Semiconductor Ram Research 11.9%
TES 5.3%
ULVAC 爱发科 4.0%
Northern Huachuang 1.7%
other devices
Electroplating equipment
Domestic manufacturers
Shengmei Shanghai
Consumables: electroplating solution
As one of the necessary materials in the chip packaging process, electroplating solutions are increasingly diverse, including copper electroplating solutions, silver electroplating solutions, gold plating solutions, tin electroplating solutions, nickel electroplating solutions and other types of electroplating solutions. Among the electroplating solutions, copper electroplating solution accounts for the highest market share, accounting for more than 60%, and will continue to maintain this trend in the next five years.
Market size
In terms of revenue, global semiconductor packaging electroplating solution revenue in 2021 will be approximately US$220 million.
my country's electroplating solution market for semiconductor packaging is developing rapidly. The market size in 2021 will be approximately US$80 million, accounting for approximately 36.4% of the global market.
【Material】
Wet electronic chemicals/high purity chemical reagents
Shanghai Xinyang
SMIC Hynix Huali Microelectronics TSMC qualified supplier
Jiang Huawei
Ultra-clean and high-purity reagents, photoresists, photoresist supporting reagents and other special wet electronic chemicals
Jingrui Shares
Ultra-clean and high-purity reagents, photoresists, and functional materials. The company’s purification technology is at the forefront among domestic and foreign peers.
Juhua Co., Ltd.
Guanghua Technology
electron gas
Classification (different application paths)
Doping gas
Epitaxy gas
ion implantation gas
Light emitting diode gas
Gas for etching
chemical vapor deposition gas
Balance Qi
major companies
Walter gas
The company has accumulated many customers such as SMIC, Huahong Grace, Yangtze Memory, China Resources Microelectronics, and TSMC, and has entered the supply chain of semiconductor companies such as Intel, Micron Technology, and Hynix.
Jacques Technology
Downstream customers Hynix Samsung TSMC
NTU Optoelectronics
other materials
Philiva
Quartz fiber. A quartz material and quartz fiber manufacturing company certified by TEL LAM AMAT. The first domestic company to have G8.5 generation large-size photomask base material.
Shengong Co., Ltd.
Semiconductor grade monocrystalline silicon material supplier
Back-end process
Wafer grinding and cutting
Consumables
dicing knife
dicing fluid
loading film
pin wire
Encapsulation
Consumables
Resin
copper foil
Molding
test
Compared with wafer manufacturing materials, the threshold for integrated circuit packaging materials is relatively low, and my country has basically achieved domestic substitution.
Integrated circuit packaging materials
die attach materials
Package substrate
lead frame
Ceramic substrate
suture
Encapsulation material
Package classification
Traditional packaging 55%
Traditional packaging and testing is a labor-intensive industry, and the price of packaging and testing is relatively low. Advanced packaging technology is more difficult and more expensive. Taking Changdian Technology as an example, the average price of advanced packaging is more than 10 times that of traditional packaging, and the gap continues to widen.
Advanced packaging 45%
The global market size of advanced packaging in 2020 is US$30.4 billion, accounting for 45%
Two major directions of advanced packaging
System on Chip (SoC, System on Chip)
From a design and wafer manufacturing perspective, integrate the components and functions required for the system onto a single chip
System in Package (SiP, System in Package)
From a packaging perspective, chips and components with different functions are assembled into one package.
Market size
The global packaging and testing market has grown from US$45.5 billion in 2011 to US$59.4 billion in 2020, with a compound annual growth rate (CAGR) of 3.0%.
The global market size of advanced packaging in 2020 is US$30.4 billion, accounting for 45%
China's packaging and testing market size has increased from 97.57 billion yuan in 2011 to 250.95 billion yuan in 2020
In 2020, China's advanced packaging output value reached 90.3 billion yuan, and the proportion of advanced packaging continued to increase, reaching 36%
Global market share of packaging and testing
ASE 27%
Taiwan
Amkor 13.5%
USA
Changdian Technology 10.82%
Jiangsu
Power 6.61%
Taiwan
Tongfu Microelectronics 5.08%
nantong
Huatian Technology 4.18%
Gansu
Zhilu closed beta 3.2%
Singapore
KYEC Electronics 2.72%
Taiwan
Nanmao 2.21%
Taiwan
Gu Bang 2.18%
Taiwan
The "Four Little Dragons" in the packaging and testing industry
Changdian Technology
Tongfu Microelectronics
Huatian Technology
Jingfang Technology
Value of wafer manufacturing equipment in 2021
Etching equipment
21.59%
Thin film deposition equipment
19.19%
Lithography equipment
18.52